Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10865304 | Heat-curable resin composition, heat-curable resin film and semiconductor device | Naoyuki KUSHIHARA, Yuki Kudo, Kazuaki Sumita, Yoshihira Hamamoto | 2020-12-15 |
| 10808102 | Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same | Shuichi Fujii, Kenji Hagiwara, Kazuaki Sumita | 2020-10-20 |
| 10793712 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | Naoyuki KUSHIHARA, Norifumi Kawamura, Yuki Kudo | 2020-10-06 |
| 10600707 | Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipment | Shuichi Fujii, Kenji Hagiwara, Shinsuke Yamaguchi | 2020-03-24 |