Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10793712 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | Yoshihiro TSUTSUMI, Naoyuki KUSHIHARA, Yuki Kudo | 2020-10-06 |
| 10676635 | Silicone-modified epoxy resin composition and semiconductor device | Shoichi Osada | 2020-06-09 |