Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10865304 | Heat-curable resin composition, heat-curable resin film and semiconductor device | Yuki Kudo, Kazuaki Sumita, Yoshihiro TSUTSUMI, Yoshihira Hamamoto | 2020-12-15 |
| 10850482 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Kazuaki Sumita, Kazunori Kondo | 2020-12-01 |
| 10829589 | Heat-curable resin composition | Kazuaki Sumita | 2020-11-10 |
| 10793712 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | Yoshihiro TSUTSUMI, Norifumi Kawamura, Yuki Kudo | 2020-10-06 |
| 10730273 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Kazunori Kondo, Kazuaki Sumita | 2020-08-04 |