Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10865304 | Heat-curable resin composition, heat-curable resin film and semiconductor device | Naoyuki KUSHIHARA, Yuki Kudo, Yoshihiro TSUTSUMI, Yoshihira Hamamoto | 2020-12-15 |
| 10850482 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Naoyuki KUSHIHARA, Kazunori Kondo | 2020-12-01 |
| 10829589 | Heat-curable resin composition | Naoyuki KUSHIHARA | 2020-11-10 |
| 10808102 | Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same | Yoshihiro TSUTSUMI, Shuichi Fujii, Kenji Hagiwara | 2020-10-20 |
| 10730273 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Naoyuki KUSHIHARA, Kazunori Kondo | 2020-08-04 |