Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10808102 | Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same | Yoshihiro TSUTSUMI, Shuichi Fujii, Kazuaki Sumita | 2020-10-20 |
| 10600707 | Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipment | Yoshihiro TSUTSUMI, Shuichi Fujii, Shinsuke Yamaguchi | 2020-03-24 |