Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10851261 | Semiconductor-encapsulating epoxy resin composition and semiconductor device | Hiroki Oishi, Ryuhei Yokota, Munenao HIROKAMI | 2020-12-01 |
| 10676635 | Silicone-modified epoxy resin composition and semiconductor device | Norifumi Kawamura | 2020-06-09 |