Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10851261 | Semiconductor-encapsulating epoxy resin composition and semiconductor device | Hiroki Oishi, Shoichi Osada, Ryuhei Yokota | 2020-12-01 |
| 10844196 | Thermally-conductive silicone composition | Kenichi Tsuji, Nobu KATO | 2020-11-24 |
| 10815323 | Silane-modified polymer, rubber compounding ingredient, and rubber composition | — | 2020-10-27 |
| 10544281 | Addition-curable silicone rubber composition and cured product | Nobu KATO | 2020-01-28 |