Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811287 | Spin coater and substrate treating apparatus having the same | Hyun Joo Jeon | 2020-10-20 |
| 10811381 | Wafer to wafer bonding method and wafer to wafer bonding system | Joon Ho Lee, Ki Ju Sohn | 2020-10-20 |
| 10763243 | Substrate bonding apparatus | Jun-Hyung Kim, Kyeong Bin Lim, Seok Ho Kim, Tae-Yeong Kim | 2020-09-01 |