Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811381 | Wafer to wafer bonding method and wafer to wafer bonding system | Joon Ho Lee, Sung-Hyup Kim | 2020-10-20 |
| 10647107 | Ultraviolet curing apparatus | Ho YU, Dong Wook Kim, Byeong Sang KIM, Kyung PARK, Ju Hyun Lee | 2020-05-12 |