Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10831795 | Method and system for providing target information using application list | — | 2020-11-10 |
| 10811381 | Wafer to wafer bonding method and wafer to wafer bonding system | Sung-Hyup Kim, Ki Ju Sohn | 2020-10-20 |