Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770447 | Method for fabricating substrate structure and substrate structure fabricated by using the method | Ho-Jin Lee, Kwang-Jin Moon, Byung-Lyul Park, Nae-In Lee | 2020-09-08 |
| 10763243 | Substrate bonding apparatus | Jun-Hyung Kim, Sung-Hyup Kim, Kyeong Bin Lim, Tae-Yeong Kim | 2020-09-01 |
| 10639875 | Wafer bonding apparatus and wafer bonding system including the same | Tae-Yeong Kim, Pil-Kyu Kang, Kwang-Jin Moon, Na-ein Lee, Ho-Jin Lee | 2020-05-05 |