Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833032 | Semiconductor device | Seong Min Son, Jeong-gi Jin, Jin Ho An, Jin-ho Chun, Ho-Jin Lee | 2020-11-10 |
| 10770447 | Method for fabricating substrate structure and substrate structure fabricated by using the method | Ho-Jin Lee, Seok Ho Kim, Byung-Lyul Park, Nae-In Lee | 2020-09-08 |
| 10763163 | Integrated circuit device and method of manufacturing the same | Su-Jeong Park, Dong-Chan Lim, Ju Bin SEO, Ju-Il Choi, Atsushi Fujisaki | 2020-09-01 |
| 10639875 | Wafer bonding apparatus and wafer bonding system including the same | Tae-Yeong Kim, Pil-Kyu Kang, Seok Ho Kim, Na-ein Lee, Ho-Jin Lee | 2020-05-05 |
| 10580726 | Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices | Jin-ho Chun, Seong Min Son, Hyung Jun Jeon, Jin Ho An, Ho-Jin Lee +1 more | 2020-03-03 |