Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833047 | Apparatuses of bonding substrates and methods of bonding substrates | Hoe Chul Kim, Dong-Eog Kim | 2020-11-10 |
| 10763243 | Substrate bonding apparatus | Jun-Hyung Kim, Sung-Hyup Kim, Kyeong Bin Lim, Seok Ho Kim | 2020-09-01 |
| 10639875 | Wafer bonding apparatus and wafer bonding system including the same | Pil-Kyu Kang, Seok Ho Kim, Kwang-Jin Moon, Na-ein Lee, Ho-Jin Lee | 2020-05-05 |