Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777487 | Integrated circuit device including through-silicon via structure and method of manufacturing the same | Ju-Il Choi, Kun-Sang Park, Son-Kwan Hwang, Ji-Soon Park | 2020-09-15 |
| 10770447 | Method for fabricating substrate structure and substrate structure fabricated by using the method | Ho-Jin Lee, Seok Ho Kim, Kwang-Jin Moon, Nae-In Lee | 2020-09-08 |
| 10651074 | Substrate processing apparatus and method of manufacture using the same | Kyoung Hwan Kim, TaeWoo Kang, Hyungjun Jeon | 2020-05-12 |