Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763230 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu +2 more | 2020-09-01 |
| 10650957 | Additive deposition low temperature curable magnetic interconnecting layer for power components integration | Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar | 2020-05-12 |
| 10541220 | Printed repassivation for wafer chip scale packaging | Daiki Komatsu, Makoto Shibuya, Hau Nguyen, Luu Thanh Nguyen, Anindya Poddar | 2020-01-21 |