Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777491 | Package comprising carrier with chip and component mounted via opening | Thorsten Meyer | 2020-09-15 |
| 10734351 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Ralf Wombacher | 2020-08-04 |
| 10629575 | Stacked die semiconductor package with electrical interposer | Carsten Ahrens, Helmut Brech, Martin Gruber, Thorsten Meyer, Matthias Zigldrum | 2020-04-21 |