Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10838018 | Multiple insertion testing of test socket | David M. Mahoney, Joseph M. Juane, Owais E. Malik | 2020-11-17 |
| 10823759 | Test system and method of testing a wafer for integrated circuit devices | Lik Huay Lim, Andy Widjaja, King Yon Lew, Xuejing Che | 2020-11-03 |
| 10783308 | Method of assigning contact elements associated with an integrated circuit device | Lik Huay Lim, Andy Widjaja, King Yon Lew, Xuejing Che | 2020-09-22 |
| 10665579 | Chip package assembly with power management integrated circuit and integrated circuit die | Stephen M. Trimberger, David M. Mahoney | 2020-05-26 |
| 10613137 | Probe head securing mechanism for probe assembly | Lik Huay Lim, King Yon Lew, Andy Widjaja | 2020-04-07 |
| 10571517 | Probe head assembly | Lik Huay Lim, King Yon Lew, Andy Widjaja | 2020-02-25 |
| 10564212 | Integrated circuit package testing system | David M. Mahoney | 2020-02-18 |
| 10539610 | Chip package test system | David M. Mahoney | 2020-01-21 |
| 10527670 | Testing system for lid-less integrated circuit packages | Gamal Refai-Ahmed, Ivor G. Barber, Suresh Ramalingam, Jaspreet S. Gandhi, Tien-Yu Lee +2 more | 2020-01-07 |