Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861774 | Internally-shielded microelectronic packages and methods for the fabrication thereof | Audel A. Sanchez, Vikas Shilimkar, Ramanujam Srinidhi Embar | 2020-12-08 |
| 10861764 | Microelectronic components having integrated heat dissipation posts and systems including the same | Mahesh K. Shah, Lu Li, David F. Abdo, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2020-12-08 |
| 10825747 | Semiconductor device package and methods of manufacture thereof | Li Li, Jaynal A. Molla | 2020-11-03 |
| 10806021 | Packaged microelectronic component mounting using sinter attachment | Lu Li, Mahesh K. Shah, Paul R. Hart | 2020-10-13 |
| 10785862 | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof | Elie A. Maalouf, Geoffrey Tucker | 2020-09-22 |
| 10741446 | Method of wafer dicing for wafers with backside metallization and packaged dies | Jaynal A. Molla, David F. Abdo, Colby Greg Rampley, Fernando A. Santos | 2020-08-11 |
| 10727153 | Thick-silver layer interface | Jaynal A. Molla | 2020-07-28 |
| 10629518 | Internally-shielded microelectronic packages and methods for the fabrication thereof | Audel A. Sanchez, Vikas Shilimkar, Ramanujam Srinidhi Embar | 2020-04-21 |
| 10573594 | Semiconductor package design providing reduced electromagnetic coupling between circuit components | Peter H. Aaen, David J. Dougherty, Manuel F. Romero | 2020-02-25 |
| 10529638 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Fernando A. Santos, Jaynal A. Molla | 2020-01-07 |