Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861764 | Microelectronic components having integrated heat dissipation posts and systems including the same | Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, David F. Abdo, Geoffrey Tucker +3 more | 2020-12-08 |
| 10825747 | Semiconductor device package and methods of manufacture thereof | Li Li, Lakshminarayan Viswanathan | 2020-11-03 |
| 10741446 | Method of wafer dicing for wafers with backside metallization and packaged dies | Lakshminarayan Viswanathan, David F. Abdo, Colby Greg Rampley, Fernando A. Santos | 2020-08-11 |
| 10727153 | Thick-silver layer interface | Lakshminarayan Viswanathan | 2020-07-28 |
| 10529638 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos | 2020-01-07 |