Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861764 | Microelectronic components having integrated heat dissipation posts and systems including the same | Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2020-12-08 |
| 10741446 | Method of wafer dicing for wafers with backside metallization and packaged dies | Jaynal A. Molla, Lakshminarayan Viswanathan, Colby Greg Rampley, Fernando A. Santos | 2020-08-11 |
| 10637400 | RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof | Jeffrey K. Jones, Basim Noori | 2020-04-28 |
| 10630246 | Methods of manufacturing encapsulated semiconductor device package with heatsink opening | Jeffrey K. Jones | 2020-04-21 |