Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861764 | Microelectronic components having integrated heat dissipation posts and systems including the same | Lakshminarayan Viswanathan, Lu Li, David F. Abdo, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2020-12-08 |
| 10806021 | Packaged microelectronic component mounting using sinter attachment | Lakshminarayan Viswanathan, Lu Li, Paul R. Hart | 2020-10-13 |
| 10630243 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Fernando A. Santos | 2020-04-21 |