Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741446 | Method of wafer dicing for wafers with backside metallization and packaged dies | Jaynal A. Molla, Lakshminarayan Viswanathan, David F. Abdo, Colby Greg Rampley | 2020-08-11 |
| 10630243 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Mahesh K. Shah | 2020-04-21 |
| 10529638 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Jaynal A. Molla | 2020-01-07 |