Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872843 | Semiconductor devices with back-side coils for wireless signal and power coupling | — | 2020-12-22 |
| 10796989 | 3D interconnect multi-die inductors with through-substrate via cores | — | 2020-10-06 |
| 10784224 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Owen R. Fay, Sameer S. Vadhavkar | 2020-09-22 |
| 10741460 | Methods for forming interconnect assemblies with probed bond pads | Owen R. Fay, Luke England, Jaspreet S. Gandhi | 2020-08-11 |
| 10734272 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2020-08-04 |
| 10685878 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kunal R. Parekh, Sarah A. Niroumand | 2020-06-16 |
| 10600689 | Vias and conductive routing layers in semiconductor substrates | Sarah A. Niroumand | 2020-03-24 |
| 10529592 | Semiconductor device assembly with pillar array | Owen R. Fay, Akshay N. Singh | 2020-01-07 |