Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685878 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kyle K. Kirby, Kunal R. Parekh | 2020-06-16 |
| 10600689 | Vias and conductive routing layers in semiconductor substrates | Kyle K. Kirby | 2020-03-24 |