Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756265 | Methods for forming narrow vertical pillars and integrated circuit devices having the same | Jun Liu | 2020-08-25 |
| 10756111 | Integrated assemblies having thicker semiconductor material along one region of a conductive structure than along another region, and methods of forming integrated assemblies | — | 2020-08-25 |
| 10734272 | Semiconductor with through-substrate interconnect | Kyle K. Kirby | 2020-08-04 |
| 10734395 | Integrated assemblies and methods of forming integrated assemblies | Justin B. Dorhout, Martin C. Roberts, Mohd Kamran Akhtar, Chet E. Carter, David Daycock | 2020-08-04 |
| 10727242 | Methods of forming an array of elevationally-extending strings of memory cells comprising a programmable charge storage transistor and arrays of elevationally-extending strings of memory cells comprising a programmable charge storage transistor | Justin B. Dorhout, Matthew Park, Joseph Neil Greeley, Chet E. Carter, Martin C. Roberts +4 more | 2020-07-28 |
| 10720446 | Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorus | Justin B. Dorhout, Fei Wang, Chet E. Carter, Ian C. Laboriante, John D. Hopkins +5 more | 2020-07-21 |
| 10700279 | Semiconductor devices and related methods | Jun Liu | 2020-06-30 |
| 10685878 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kyle K. Kirby, Sarah A. Niroumand | 2020-06-16 |
| 10586807 | Arrays of elevationally-extending strings of memory cells having a stack comprising vertically-alternating insulative tiers and wordline tiers and horizontally-elongated trenches in the stacks | Zhiqiang Xie, Chris M. Carlson, Justin B. Dorhout, Anish A. Khandekar, Greg Light +3 more | 2020-03-10 |