Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796997 | Semiconductor package | Han Na Jin, Tae Sung Jeong, Young Gwan Ko, Jung Soo Byun | 2020-10-06 |
| 10790224 | Carrier substrate and method of manufacturing semiconductor package using the same | Tae Sung Jeong, Young Gwan Ko, Ik Jun Choi, Jung Soo Byun | 2020-09-29 |
| 10665535 | Semiconductor package | Tae Sung Jeong, Young Gwan Ko, Suk Ho Lee, Jung Soo Byun | 2020-05-26 |
| 10636743 | Electronic component package and manufacturing method of the same | Yong Ho Baek, Sang Kun Kim, Ye-Jeong Kim, Jae Hoon Choi | 2020-04-28 |