Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796997 | Semiconductor package | Jae Ean LEE, Han Na Jin, Tae Sung Jeong, Young Gwan Ko | 2020-10-06 |
| 10790224 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Tae Sung Jeong, Young Gwan Ko, Ik Jun Choi | 2020-09-29 |
| 10665535 | Semiconductor package | Jae Ean LEE, Tae Sung Jeong, Young Gwan Ko, Suk Ho Lee | 2020-05-26 |