Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879189 | Semiconductor device and method for manufacturing the same | Han Ul Lee, Jin Su Kim | 2020-12-29 |
| 10825775 | Semiconductor package integrating active and passive components with electromagnetic shielding | Myung Sam Kang, Jin Su Kim, Yong Jin Park, Yong Jin SEOL | 2020-11-03 |
| 10818604 | Semiconductor package | Myung Sam Kang, Yong Jin Park, Moon Il Kim | 2020-10-27 |
| 10811328 | Semiconductor package | Myung Sam Kang, Moon Il Kim | 2020-10-20 |
| 10796997 | Semiconductor package | Jae Ean LEE, Han Na Jin, Tae Sung Jeong, Jung Soo Byun | 2020-10-06 |
| 10790224 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Tae Sung Jeong, Ik Jun Choi, Jung Soo Byun | 2020-09-29 |
| 10770418 | Fan-out semiconductor package | Da Hee Kim | 2020-09-08 |
| 10727212 | Semiconductor package | Seon Hee Moon, Myung Sam Kang, Chang Bae Lee, Jin Su Kim | 2020-07-28 |
| 10665535 | Semiconductor package | Jae Ean LEE, Tae Sung Jeong, Suk Ho Lee, Jung Soo Byun | 2020-05-26 |
| 10573613 | Fan-out semiconductor package | Da Hee Kim | 2020-02-25 |
| 10541221 | Fan-out semiconductor package | Yong Jin SEOL, Myung Sam Kang | 2020-01-21 |