Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10828871 | Carrier substrate and method of manufacturing semiconductor package using the same | — | 2020-11-10 |
| 10796997 | Semiconductor package | Jae Ean LEE, Tae Sung Jeong, Young Gwan Ko, Jung Soo Byun | 2020-10-06 |