Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796997 | Semiconductor package | Jae Ean LEE, Han Na Jin, Young Gwan Ko, Jung Soo Byun | 2020-10-06 |
| 10790224 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Young Gwan Ko, Ik Jun Choi, Jung Soo Byun | 2020-09-29 |
| 10665535 | Semiconductor package | Jae Ean LEE, Young Gwan Ko, Suk Ho Lee, Jung Soo Byun | 2020-05-26 |
| 10580728 | Fan-out semiconductor package | Sung Han Kim, Masazumi Amagai, Ju Ho Kim | 2020-03-03 |
| 10580812 | Fan-out sensor package and camera module including the same | Ju Ho Kim | 2020-03-03 |