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EMI shielding for flip chip package with exposed die backside |
SungWon Cho, ChangOh Kim, InSang Yoon, KyoungHee Park |
2020-10-13 |
| 10797039 |
Semiconductor device and method of forming a 3D interposer system-in-package module |
DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon |
2020-10-06 |
| 10790158 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern |
Yaojian Lin, Kang Chen, Hin Hwa Goh |
2020-09-29 |
| 10777528 |
Semiconductor device and method of forming embedded wafer level chip scale packages |
Yaojian Lin, Pandi C. Marimuthu, Byung Joon Han |
2020-09-15 |
| 10730745 |
Semiconductor device and method of forming MEMS package |
Yaojian Lin |
2020-08-04 |
| 10707150 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units |
Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu |
2020-07-07 |
| 10658330 |
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages |
Byung Joon Han, Yaojian Lin, Pandi C. Marimuthu |
2020-05-19 |