Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777528 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Il Kwon Shim, Byung Joon Han | 2020-09-15 |
| 10707150 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Yaojian Lin, Kang Chen, Yu Gu | 2020-07-07 |
| 10658330 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Il Kwon Shim, Yaojian Lin | 2020-05-19 |
| 10636753 | Antenna in embedded wafer-level ball-grid array package | Andy Chang Bum Yong, Aung Kyaw Oo, Yaojian Lin | 2020-04-28 |
| 10622293 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Kang Chen, Xusheng Bao +1 more | 2020-04-14 |