Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777528 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim | 2020-09-15 |
| 10658330 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu | 2020-05-19 |