Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643938 | Standoff spacers for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, John J. Beatty, Sachin Deshmukh | 2020-05-05 |
| 10580717 | Multiple-chip package with multiple thermal interface materials | Boxi LIU, Syadwad Jain, James C. Matayabas, Jr. | 2020-03-03 |