Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643938 | Standoff spacers for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty | 2020-05-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643938 | Standoff spacers for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty | 2020-05-05 |