Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714411 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Wolfgang Sauter, Mark W. Kuemerle, Eric W. Tremble, Nicholas A. Polomoff, Eric S. Parent +2 more | 2020-07-14 |
| 10685919 | Reduced-warpage laminate structure | Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell +1 more | 2020-06-16 |
| 10566300 | Bond pads with surrounding fill lines | Scott K. Pozder, Thiagarajan Raman, Kristina Young-Fisher | 2020-02-18 |
| 10553544 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2020-02-04 |