Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643912 | Chip package interaction (CPI) back-end-of-line (BEOL) monitoring structure and method | Eng Chye Chua | 2020-05-05 |
| 10566300 | Bond pads with surrounding fill lines | Thiagarajan Raman, Kristina Young-Fisher, David B. Stone | 2020-02-18 |