| 10818623 |
Mixed UBM and mixed pitch on a single die |
Charles L. Arvin |
2020-10-27 |
| 10804241 |
Non-porous copper to copper interconnect |
Charles L. Arvin |
2020-10-13 |
| 10790253 |
Conductive pillar shaped for solder confinement |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2020-09-29 |
| 10615137 |
Corrosion resistant aluminum bond pad structure |
Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Wolfgang Sauter |
2020-04-07 |
| 10600751 |
Conductive pillar shaped for solder confinement |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2020-03-24 |
| 10590561 |
Continuous modification of organics in chemical baths |
Charles L. Arvin |
2020-03-17 |
| 10586782 |
Lead-free solder joining of electronic structures |
Charles L. Arvin, Clement Fortin, Brian W. Quinlan, Thomas A. Wassick, Thomas Weiss |
2020-03-10 |
| 10570527 |
Continuous modification of organics in chemical baths |
Charles L. Arvin |
2020-02-25 |
| 10553555 |
Non-porous copper to copper interconnect |
Charles L. Arvin |
2020-02-04 |
