Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847463 | Seed layers for copper interconnects | Zhiyuan Wu, Meng Chu Tseng, Mehul Naik | 2020-11-24 |
| 10665542 | Cobalt manganese vapor phase deposition | Sang Ho Yu, Paul F. Ma, Jiang Lu | 2020-05-26 |
| 10636655 | Methods for asymmetric deposition of metal on high aspect ratio nanostructures | Bencherki Mebarki, Joung Joo Lee, Ismail Emesh, Roey Shaviv, Xianmin Tang | 2020-04-28 |