| 10847458 |
BEOL electrical fuse and method of forming the same |
Chih-Chao Yang |
2020-11-24 |
| 10847475 |
Advanced crack stop structure |
Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla |
2020-11-24 |
| 10840447 |
Fabrication of phase change memory cell in integrated circuit |
Chih-Chao Yang, Andrew Tae Kim, Barry P. Linder |
2020-11-17 |
| 10840195 |
Advanced crack stop structure |
Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla |
2020-11-17 |
| 10840194 |
Advanced crack stop structure |
Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla |
2020-11-17 |
| 10811353 |
Sub-ground rule e-Fuse structure |
Chih-Chao Yang, Andrew Tae Kim, Ernest Y. Wu |
2020-10-20 |
| 10784159 |
Semiconductor device and method of forming the semiconductor device |
Lawrence A. Clevenger, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang |
2020-09-22 |
| 10770393 |
BEOL thin film resistor |
Andrew Tae Kim, Ernest Y. Wu, Chih-Chao Yang |
2020-09-08 |
| 10763210 |
Circular ring shaped antifuse device |
Chih-Chao Yang |
2020-09-01 |
| 10741441 |
Collar formation for chamfer-less and chamfered vias |
Chih-Chao Yang, Andrew Tae Kim |
2020-08-11 |
| 10699950 |
Method of optimizing wire RC for device performance and reliability |
Lawrence A. Clevenger, Kirk D. Peterson, John E. Sheets, II, Terry A. Spooner |
2020-06-30 |
| 10651083 |
Graded interconnect cap |
Andrew Tae Kim, Ernest Y. Wu, Chih-Chao Yang |
2020-05-12 |
| 10636738 |
Contacts having a geometry to reduce resistance |
Lawrence A. Clevenger, Kirk D. Peterson, Terry A. Spooner, Junli Wang |
2020-04-28 |
| 10615112 |
MIM capacitor for improved process defect tolerance |
Chih-Chao Yang, Andrew Tae Kim |
2020-04-07 |
| 10539611 |
Integrated circuit chip reliability qualification using a sample-specific expected fail rate |
Jeanne P. Bickford, Nazmul Habib, Tad J. Wilder |
2020-01-21 |
| 10534888 |
Hybrid back end of line metallization to balance performance and reliability |
Chih-Chao Yang, Theo Standaert |
2020-01-14 |
