Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872832 | Pre-molded active IC of passive components to miniaturize system in package | John G. Meyers, Yong She, Bin Liu, Lingyan L. Tan | 2020-12-22 |
| 10756072 | Conductive wire through-mold connection apparatus and method | — | 2020-08-25 |
| 10748873 | Substrates, assembles, and techniques to enable multi-chip flip chip packages | Min-Tih Lai, Tyler Leuten | 2020-08-18 |