Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872880 | Land grid array package extension | Min-Tih Lai | 2020-12-22 |
| 10748873 | Substrates, assembles, and techniques to enable multi-chip flip chip packages | Mao Guo, Min-Tih Lai | 2020-08-18 |