Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872880 | Land grid array package extension | Tyler Leuten | 2020-12-22 |
| 10847450 | Compact wirebonding in stacked-chip system in package, and methods of making same | Saeed S. Shojaie, Hyoung Il Kim, Bilal Khalaf | 2020-11-24 |
| 10770429 | Microelectronic device stacks having interior window wirebonding | Cory A. Runyan | 2020-09-08 |
| 10748873 | Substrates, assembles, and techniques to enable multi-chip flip chip packages | Mao Guo, Tyler Leuten | 2020-08-18 |
| 10573575 | Semiconductor package with thermal fins | Hyoung Il Kim, Florence R. Pon, Yi Xu, Yuhong Cai, Leo Craft | 2020-02-25 |