Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847450 | Compact wirebonding in stacked-chip system in package, and methods of making same | Hyoung Il Kim, Bilal Khalaf, Min-Tih Lai | 2020-11-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847450 | Compact wirebonding in stacked-chip system in package, and methods of making same | Hyoung Il Kim, Bilal Khalaf, Min-Tih Lai | 2020-11-24 |