Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872832 | Pre-molded active IC of passive components to miniaturize system in package | Mao Guo, John G. Meyers, Bin Liu, Lingyan L. Tan | 2020-12-22 |
| 10770434 | Stair-stacked dice device in a system in package, and methods of making same | Zhicheng Ding, Bin Liu, Aiping Tan, Li Deng | 2020-09-08 |
| 10727208 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Zhicheng Ding, Bin Liu, Aiping Tan, Li Deng | 2020-07-28 |