Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872832 | Pre-molded active IC of passive components to miniaturize system in package | Mao Guo, John G. Meyers, Yong She, Bin Liu | 2020-12-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872832 | Pre-molded active IC of passive components to miniaturize system in package | Mao Guo, John G. Meyers, Yong She, Bin Liu | 2020-12-22 |