Issued Patents 2020
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10856407 | Transmission line design with routing-over-void compensation | Khang Choong Yong, Bok Eng Cheah, Stephen H. Hall, Yun Rou Lim | 2020-12-01 |
| 10840177 | Interposer with flexible portion | Bok Eng Cheah, Min Suet Lim, Tin Poay Chuah | 2020-11-17 |
| 10734333 | Semiconductor package having inductive lateral interconnects | Bok Eng Cheah, Khang Choong Yong, Howard L. Heck | 2020-08-04 |
| 10734318 | Folded semiconductor package architectures and methods of assembling same | Bok Eng Cheah, Khang Choong Yong, Yun Rou Lim | 2020-08-04 |
| 10716209 | Fiber weave-sandwiched differential pair routing technique | Bok Eng Cheah, Eng Huat Goh, Khang Choong Yong, Min Suet Lim | 2020-07-14 |
| 10651127 | Ring-in-ring configurable-capacitance stiffeners and methods of assembling same | Bok Eng Cheah, Kooi Chi Ooi, Paik Wen Ong | 2020-05-12 |
| 10652999 | Mutual inductance suppressor for crosstalk immunity enhancement | Khang Choong Yong, Bok Eng Cheah, Stephen H. Hall | 2020-05-12 |
| 10643983 | Extended stiffener for platform miniaturization | Eng Huat Goh, Bok Eng Cheah, Min Suet Lim, Khang Choong Yong, Howe Yin Loo | 2020-05-05 |
| 10633898 | Micro-hinge for an electronic device | Bok Eng Cheah, Howe Yin Loo, Min Suet Lim, Poh Tat Oh | 2020-04-28 |
| 10606316 | Flexible computing device that includes a plurality of displays | Kooi Chi Ooi, Bok Eng Cheah, Eng Huat Goh | 2020-03-31 |
| 10593618 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Mooi Ling Chang, Ping Ping Ooi, Wen Wei Lum | 2020-03-17 |
| 10580761 | Systems in packages including wide-band phased-array antennas and methods of assembling same | Bok Eng Cheah, Boon Ping Koh, Kooi Chi Ooi | 2020-03-03 |
| 10541200 | Over-molded IC packages with embedded voltage reference plane and heater spreader | Ping Ping Ooi, Bok Eng Cheah, Mooi Ling Chang, Wen Wei Lum | 2020-01-21 |