Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10856407 | Transmission line design with routing-over-void compensation | Bok Eng Cheah, Jackson Chung Peng Kong, Stephen H. Hall, Yun Rou Lim | 2020-12-01 |
| 10796999 | Floating-bridge interconnects and methods of assembling same | Boon Ping Koh, Eng Huat Goh, Jiun Hann Sir, Min Suet Lim, Wil Choon Song | 2020-10-06 |
| 10772206 | Board to board interconnect | Chee Ling Wong, Wil Choon Song, Eng Huat Goh, Mohd Muhaiyiddin Bin Abdullah, Tin Poay Chuah | 2020-09-08 |
| 10734318 | Folded semiconductor package architectures and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Yun Rou Lim | 2020-08-04 |
| 10734333 | Semiconductor package having inductive lateral interconnects | Jackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck | 2020-08-04 |
| 10716209 | Fiber weave-sandwiched differential pair routing technique | Bok Eng Cheah, Eng Huat Goh, Jackson Chung Peng Kong, Min Suet Lim | 2020-07-14 |
| 10701796 | Electromagnetic interference (EMI) shield | Tin Poay Chuah, Yew San Lim, Khai Ern See, Kevin Byrd | 2020-06-30 |
| 10652999 | Mutual inductance suppressor for crosstalk immunity enhancement | Jackson Chung Peng Kong, Bok Eng Cheah, Stephen H. Hall | 2020-05-12 |
| 10643983 | Extended stiffener for platform miniaturization | Eng Huat Goh, Bok Eng Cheah, Jackson Chung Peng Kong, Min Suet Lim, Howe Yin Loo | 2020-05-05 |
| 10609813 | Capacitive interconnect in a semiconductor package | Eng Huat Goh, Min Suet Lim, Fern Nee Tan, Jiun Hann Sir | 2020-03-31 |