Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10856407 | Transmission line design with routing-over-void compensation | Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong, Stephen H. Hall | 2020-12-01 |
| 10734318 | Folded semiconductor package architectures and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong | 2020-08-04 |