Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10609813 | Capacitive interconnect in a semiconductor package | Eng Huat Goh, Min Suet Lim, Khang Choong Yong, Jiun Hann Sir | 2020-03-31 |
| 10560094 | Isolation module for use between power rails in an integrated circuit | Sanjiv Soman, Alexander Levin, Srinivasan Rajagopalan | 2020-02-11 |